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Heatsink with fan - List of Manufacturers, Suppliers, Companies and Products

Heatsink with fan Product List

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Axial fan heat sink with power semiconductor clip LAM4K

TO-247plus compatible, fan-equipped heat sink with a width of 40mm and a height of 40mm that can secure the transistor with a clip (spring).

Our company, Aquas, is the official domestic distributor of the German global manufacturer Fischer Elektronik. LAM 4 K heat sink with axial fan for board mounting The heat sink, measuring 40mm in width and 40mm in height, is equipped with an axial fan, allowing for efficient heat dissipation in a compact design. Transistors can be secured on the side with a spring (sold separately). Lengths are available in 50mm, 75mm, 100mm, 125mm, and 150mm. The axial fan can be selected from 5V, 12V, or 24V DC. *Please feel free to contact us for more details.

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  • Other semiconductors

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JSC00123-A Fan-equipped Heat Sink

A slim fan sink with a height of 12.7mm and a unique finger guard.

JARO Thermal's fan-equipped heatsink, adopted for mass production by global semiconductor manufacturers, graphic card manufacturers, and PC manufacturers. "JSC00123-A" IC cooler L45.0 x W45.0 x H12.7 mm - Low thermal resistance despite being thin and suitable for narrow spaces - Unique method of integrating the fan into the heatsink reduces fan installation steps - Proprietary finger guard design - Low power consumption - Operates with low noise to CFM ratio - RoHS compliant

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  • fan

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JSC00151 Fan-equipped heat sink

Thin fancy sink with a height of 13mm (L70.0 x W60.0 x H13.0 mm)

JARO Thermal's fan-equipped heatsink, adopted for mass production by global semiconductor manufacturers, graphics card manufacturers, and PC manufacturers. "JSC00151" IC cooler - Low thermal resistance despite being slim and suitable for tight spaces - Unique method of integrating the fan into the heatsink reduces fan installation steps - Low power consumption - Operates with a low noise to CFM ratio - RoHS compliant

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  • fan

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JSC00150 Fan-equipped heat sink

Thin fancy sink with a height of 13.3mm (L55.0 x W55.0 x H13.3 mm)

JARO Thermal's fan-equipped heatsink, adopted for mass production by global semiconductor manufacturers, graphic card manufacturers, and PC manufacturers. "JSC00150" IC cooler - Low thermal resistance despite being slim and suitable for tight spaces - The unique method of integrating the fan into the heatsink reduces the installation steps for the fan. - Low power consumption - Operates with a low noise to CFM ratio. - RoHS compliant

  • logo JARO Thermal.png
  • fan

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Fan-equipped heat sink with louvered fins

Cooling system combining a louvered fin type heat sink and axial-tangential fan.

At Aquas Co., Ltd., we are an authorized distributor of Altronic GmbH (Germany), which has high processing and surface treatment technology. "LK 10/200/A" Width [mm]: 104.5 Height [mm]: 80.0 Length [mm]: 278.0 Pressure chamber length [mm]: 200.0 Minimum thermal resistance [K/W]: 0.13 Unit weight [g]: 2300.0 Maximum power loss [W]: 200.0 Optimized by a special louver structure. Two surfaces can be utilized to attach cooling semiconductor modules as needed. The technical data pertains to the installation of flat machined mounting surfaces with uniform load distribution. An air flow chamber between the fan and fin unit ensures optimal air distribution to all fins. Please check our website for other models.

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  • Other electronic parts

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Fan-equipped heat sink, vertical configuration type

Only 225g! A lightweight unit with a unique style heat sink that has holes in the fins and a vertically mounted SEPA fan.

At Aqua Co., Ltd., we are an authorized distributor of Altronic GmbH (Germany), which has high processing and surface treatment technology. "PK181-80-AL-24V" Width [mm]: 80.0 Height [mm]: 77.0 Length [mm]: 80.0 Fan Voltage [V] DC24 Minimum Thermal Resistance [K/W]: 1.1 Unit Weight [g]: 225.0 Maximum Power Loss [W]: 100.0 * The SEPA axial fan with a finger guard efficiently dissipates heat. * You can choose from two types of fan voltage (DC24V, AC230V). * The mounting surface is processed to be flat to optimize heat transfer.

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  • Other electronic parts

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